Contact Us
  • TEL: +86-575-83706099
  • FAX:+86-575-85728853
  • Mob: +86 13735660533
  • Email:
  • ADD:Junma electroplate factory, Keqiao District, Shaoxing City, Zhejiang, China.

Causes and solutions for quality problems in copper clad steel flat wire copper plating process


Causes and solutions for quality problems in copper-clad steel flat wire copper plating process

When the copper-clad steel flat steel is produced by electroplating, it is very important for the pre-treatment of the flat wire. If the oil stain and oxide film on the surface of the flat wire are not completely eliminated, the pre-plated nickel layer is not plated well, and the bonding force is poor, which eventually causes the plating of the main copper plating to fall off. Therefore, always pay attention to the concentration of washing and pickling solution, pickling and washing current and whether the pump is normal. If it is not normal, it must be repaired in time.

Effect of pre-nickel plating solution on the coating of copper-clad steel flat steel The stability clock of the pre-nickel plating solution determines the quality of the pre-plating layer and plays an important role in the next main copper plating. Therefore, it is necessary to periodically analyze and adjust the distribution ratio of the pre-plated nickel solution, and at the same time ensure that the pre-plated nickel solution is clean and must not be contaminated.

The electroplating solution contains two components, copper sulfate and sulfuric acid, and its distribution ratio determines the quality of the coating. The concentration of copper sulfate is too high, and copper sulfate crystallizes out; the concentration of copper sulfate is too low, and the flat wire is easily burnt, which affects the plating efficiency. Sulfuric acid can improve the conductivity and current efficiency of the plating solution, reduce the copper ion concentration (same ion effect) in the plating solution, thereby improving the cathodic polarization and the dispersing ability of the plating solution, increasing the current density limit, and preventing the sulfuric acid in the plating solution. The cuprous copper is hydrolyzed into cuprous oxide and precipitated, which increases the stability of the plating solution, and at the same time reduces the anodic polarization and facilitates the normal dissolution of the anode. However, it should be noted that too high a sulfuric acid content will reduce the solubility of copper sulfate.